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Low-dielectric compositions with controlled crystallization and thermal expansion

机译:具有控制的结晶和热膨胀的低介电成分

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Cristobalite is formed in an initially amorphous low-dielectric lead borosilicate glass at 700-900℃. With added alumina content greater than a critical value, however, the cristobalite formation in the lead borosilicate glass is completely inhibited. The critical alumina content is found to decrease with decreasing alumina particle size but with increasing sintering temperature. This result is attributed to a strong coupling reaction between Al~(3+) from alumina and Na~+ and Pb~(2+) from lead borosilicate glass. The resulting cristobalite-free glass composite has a dielectric constant of 5.0 at 1 MHz and a thermal expansion coefficient of (2.5 - 4.0) x 10~(-6) K~(-1) in the temperature range of 25-200℃.
机译:在最初的非晶态低介电硼硅酸铅玻璃中于700-900℃形成方石英。但是,如果添加的氧化铝含量大于临界值,则完全抑制了硼硅酸铅玻璃中方石英的形成。发现临界氧化铝含量随着氧化铝粒度的减小而降低,但随着烧结温度的升高而降低。该结果归因于氧化铝的Al〜(3+)与硼硅酸铅玻璃的Na〜+与Pb〜(2+)之间的强偶联反应。所得不含方石英的玻璃复合材料在25-200℃的温度范围内在1 MHz时的介电常数为5.0,热膨胀系数为(2.5-4.0)x 10〜(-6)K〜(-1)。

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