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Plasma oxidation of the insulation layer in the magnetic tunneling junctions

机译:磁性隧穿结中绝缘层的等离子体氧化

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Ferromagnetic tunneling junctions with Al-oxide and Ta-oxide as insulating layers were fabricated and the microstructure of the oxide layers was investigated with cross-sectional transmission electron microscopy (TEM). TEM analysis showed that as the Al-oxide thickness increased from 13 to 63 A, the roughness rapidly increased and the magnetoresistive (MR) ratio also markedly dropped. The undulation of the Al-oxide with increasing thickness was proved to have resulted from the plasma oxidation process. In contrast, Ta-oxide layer remained flat regardless of the layer thickness. In comparison to the Al-oxide layer, partially oxidized Ta-layer junction exhibited poor MR characteristics. Growth mechanism for Al- and Ta-oxide layers microstructure is proposed in terms of oxidation kinetics and oxygen plasma characteristics.
机译:制备了以Al和Ta为绝缘层的铁磁隧道结,并用截面透射电子显微镜(TEM)研究了氧化物层的微观结构。 TEM分析表明,随着氧化铝厚度从13 A增加到63 A,粗糙度迅速增加,磁阻(MR)比也显着下降。事实证明,随着厚度的增加,氧化铝的起伏起因于等离子体氧化过程。相反,无论层厚如何,Ta氧化物层均保持平坦。与氧化铝层相比,部分氧化的Ta层结表现出较差的MR特性。根据氧化动力学和氧等离子体特性,提出了Al和Ta氧化物层微结构的生长机理。

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