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Influence Of Cu Addition On The Self-propagating High-temperature Synthesis Of Ti_5si_3 In Cu-ti-si System

机译:Cu添加对Cu-ti-si体系中Ti_5si_3自蔓延高温合成的影响

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The self-propagating high-temperature synthesis (SHS) reactions can take place in Cu-Ti-Si systems with Cu additions of 10-50 wt.%, and the products only consist of Ti_5Si_3 and Cu phases, without any transient phase. In Ti-Si system, most of the Ti_5Si_3 grains synthesized exhibit the polygon-shaped coarse appearance with an obviously sintered morphology. When Cu content increases from 10 to 50 wt.%, however, the Ti_5Si_3 exhibits cobblestone-like shape with a relatively smooth surface, and its average size decreases significantly from ~15 to ~2 μm or less. The formation mechanism of Ti_5Si_3 in Cu-Ti-Si system is characterized by the solution, reaction and precipitation processes. Furthermore, the addition of Cu has a great influence on the volume change between green and reacted preforms. The volume change increases with Cu content increasing from 0 to 20 wt.%, and then decreases with the content further increasing from 20 to 50 wt.%. The addition of Cu to Ti-Si system significantly decreases the onset temperature of the reaction during differential scanning calorimetry process, which is even much lower than the α→β transition temperature of Ti (882℃), suggesting that the reaction could be greatly facilitated by Cu addition. As a result, the role of Cu serves not only as a diluent but also as a reactant and participates in the self-propagating high-temperature synthesis reaction process.
机译:自蔓延高温合成(SHS)反应可以在Cu-Ti-Si系统中进行,其中Cu添加量为10-50 wt。%,产物仅由Ti_5Si_3和Cu相组成,没有任何过渡相。在Ti-Si体系中,大多数合成的Ti_5Si_3晶粒呈现出多边形的粗糙外观,并具有明显的烧结形态。然而,当Cu含量从10wt。%增加到50wt。%时,Ti_5Si_3呈现出具有相对光滑的表面的鹅卵石形状,并且其平均尺寸从〜15μm或更小地显着减小。 Cu-Ti-Si体系中Ti_5Si_3的形成机理以固溶,反应和沉淀过程为特征。此外,铜的添加对生坯和已反应的预成型坯之间的体积变化有很大的影响。体积变化随着Cu含量从0到20wt。%增加而增加,然后随着Cu含量从20到50wt。%进一步增加而减小。在Ti-Si体系中添加Cu显着降低了差示扫描量热法中反应的起始温度,甚至比Ti的α→β转变温度(882℃)低得多,这表明该反应可以大大促进由铜加成。结果,Cu的作用不仅充当稀释剂而且充当反应物,并且参与自蔓延的高温合成反应过程。

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