Thermal and electrical properties of W-Cu composite produced by activated sintering

摘要

In this work, nearly full density W-23.5 wt.% Cu composite was fabricated by activated sintering with Zn additive. Because of low melting point and high saturated vapor pressure for Zn, Zn additive was introduced into W-23.5 wt.% Cu composite to enhance the densiflcation of W-Cu composite. The effects of rel-ative density, Zn additive contents, microstructure and fractographs on thermal conductivity, electrical conductivity and coefficient of thermal expansion were evaluated by scanning electron micrograph, energy disperse spectrum, X-ray photoelectron spectroscopy and Archimedes method. It was found that adding Zn additive led high relative density for W-Cu composite while thermal conductivity and electrical conductivity were preserved at good values which were 198.5 Wm~(-1) K~(-1) and 1.44 × 10~(-6)(Ωm)~(-1) respectively. The fractographs of W-Cu composite indicated the presence of strong grain-boundaries, which was beneficial to the thermal conductivity and electrical conductivity. The coefficient of thermal expansion was decreased to appropriate value from 9.58 × 10~(-6) to 8.75 × 10~(-6)K~(-1) by controlling Zn additive content.