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Influence of hot pressing temperature on the microstructure and mechanical properties of 75% Cu-25% Sn alloy

机译:热压温度对75%Cu-25%Sn合金组织和力学性能的影响

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摘要

The alloy of 75% Cu-25% Sn was utilised and hot-pressed for 4 min at 421,520 and 600 ℃ to obtain a self-sharpening bond for diamond honing stones at low sintering temperature. Densification and mechanical tests were performed, and structures were investigated by X-ray diffraction, energy dispersive spectros-copy and scanning electron microscopy. Results showed that the porous structures changed into micro-porous structures when the hot pressing temperature was increased from 421 ℃ to 600 ℃. The mechanical properties improved from HRB 79.1 to HRB 105.1 in hardness and from 104.2 MPa to 201.4 MPa in transverse rupture strength. After hot pressing at 600 ℃, the microstructure consisted of α(Cu) + 8 eutectoid and micropores, which meets the requirements of bonds for honing stones.
机译:利用75%Cu-25%Sn的合金在421,520和600℃下热压4分钟,以获得低烧结温度下金刚石珩磨石的自锐键。进行了致密化和机械测试,并通过X射线衍射,能量色散光谱和扫描电子显微镜研究了结构。结果表明,当热压温度从421℃提高到600℃时,多孔结构转变为微孔结构。机械性能的硬度从HRB 79.1提高到HRB 105.1,横向断裂强度从104.2 MPa提高到201.4 MPa。 600℃热压后,组织由α(Cu)+ 8共析物和微孔组成,满足珩磨结石的要求。

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  • 来源
    《Materials & design》 |2014年第1期|38-42|共5页
  • 作者单位

    Key Lab of Metastable Materials Science & Technology, College of Material Science & Engineering, Yanshan University, Qinhuangdao 066004, China;

    Key Lab of Metastable Materials Science & Technology, College of Material Science & Engineering, Yanshan University, Qinhuangdao 066004, China;

    College of Materials Science & Engineering, Henan University of Technology, Zhengzhou 450007, China;

    Key Lab of Metastable Materials Science & Technology, College of Material Science & Engineering, Yanshan University, Qinhuangdao 066004, China;

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