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A comprehensive microstructural analysis of Al-WC micro- and nano-composites prepared by spark plasma sintering

机译:火花等离子体烧结制备的Al-WC微纳米复合材料的全面组织分析

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There have been many investigations on metal matrix microcomposites produced by conventional casting routes; however, in the past decade, the focus has shifted more toward nanocomposites produced via solid state routes. To have a realistic view of performance prediction and optimum design of such composites, in this work Al matrix composites (AMCs) reinforced with WC microparticles, nanoparticles, and bimodal micro-ano-particles were prepared by spark plasma sintering, The effects of particle size and concentration, and process variables (i.e. sintering temperature, duration, and pressure) on the evolution of microstructure, density and hardness of the composites were studied comprehensively. Full densification of AMCs with high particle concentration was problematic because of ceramic cluster formations in the microstructure. This effect was more emphasized in AMCs containing nanoparticles. AMCs with micropartides were more easily densified, but their hardness benefits were inferior. On the other hand, the mixture of micro- and nano-particles in Al-WC bimodal composites led to better matrix reinforcement integrity and an overall improvement in the microstructural properties. Finally, increasing the sintering temperature improved the microstructural features and hardness of the composites (more enhanced in high wt.% samples), but sintering duration and pressure did not have a big impact on the composite properties. (C) 2017 Elsevier Ltd. All rights reserved.
机译:对于通过常规铸造路线生产的金属基体微复合材料已经进行了许多研究。然而,在过去的十年中,重点已转移到通过固态途径生产的纳米复合材料上。为了对此类复合材料的性能预测和最佳设计有一个现实的认识,在这项工作中,通过火花等离子烧结制备了由WC微粒,纳米颗粒和双峰微/纳米颗粒增强的Al基复合材料(AMC),全面研究了复合材料的尺寸和浓度,以及工艺变量(即烧结温度,持续时间和压力)对复合材料组织,密度和硬度的影响。由于微结构中的陶瓷团簇形成,具有高颗粒浓度的AMC的完全致密化是有问题的。在包含纳米颗粒的AMC中,这种效果更加突出。带有微颗粒的AMC较容易致密,但其硬度优势较差。另一方面,Al-WC双峰复合材料中的微粒和纳米颗粒的混合物导致更好的基体增强完整性和微观结构性质的整体改善。最后,提高烧结温度改善了复合材料的微观结构特征和硬度(在高wt。%的样品中提高了),但是烧结时间和压力对复合材料的性能影响不大。 (C)2017 Elsevier Ltd.保留所有权利。

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