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1-Mb memory chip using giant magnetoresistive memory cells

机译:使用巨型磁阻存储单元的1 Mb存储芯片

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A 1-Mb nonvolatile, nondestructive readout M-R memory chip using elements with Giant Magnetoresistance Ratio (GMR) material has been designed. The chip employs dual redundancy, CMOS drive electronics with minimum gate lengths of 0.8 microns, two metal layers, and a 5-V /spl plusmn/10% power supply. The layout has an area of 0.9 cm sq, and approximately 50% of the chip area is devoted to the memory cell array. The memory chip is designed around 1.4 /spl mu/m/spl times/6.1 /spl mu/m, 80-/spl Omega/ elements using GMR material; the elements are spaced 1.4 /spl mu/m apart. The material is composed of two 50-/spl Aring/ ternary alloy layers separated by 30 /spl Aring/ of copper and has a nominal M-R coefficient of 6.0%. Minimum read signal is /spl plusmn/2.5 mV; sense current is 2.5 mA; work current is /spl plusmn/30 mA; and input and output is 4b wide. The memory employs a new read scheme in which two-phase sensing is employed. The scheme provides a sensitive, stable output and diminishes the array area by a factor of two, at the expense of read access time. The design contains over 700000 transistors and over 2 million memory cells; a prototype 64 K section of this design has been built, but the full design has yet to be constructed on silicon. The design demonstrates that with GMR memory cells, M-R memories can be designed with densities and speeds comparable to dynamic RAM's.
机译:设计了一种使用巨型磁阻比(GMR)材料的1-Mb非易失性,无损读出M-R存储芯片。该芯片采用双冗余,最小栅极长度为0.8微米的CMOS驱动电子器件,两个金属层以及5V / spl的正负10%电源。该布局的面积为0.9平方厘米,大约50%的芯片面积专用于存储单元阵列。使用GMR材料将存储芯片设计为1.4 / spl mu / m / spl次/6.1/spl mu / m,80- / spl Omega /元件;元素间隔为1.4 / spl mu / m。该材料由两层50- / spl Aring /三元合金层组成,每层由30 / spl Aring /的铜隔开,标称M-R系数为6.0%。最小读取信号为/ spl plusmn / 2.5 mV;检测电流为2.5 mA;工作电流为/ spl plusmn / 30 mA;输入和输出为4b宽。该存储器采用新的读取方案,其中采用了两相感测。该方案提供了灵敏,稳定的输出,并将阵列区域减小了两倍,但以读取访问时间为代价。该设计包含超过700万个晶体管和超过200万个存储单元。已经完成了该设计的64 K原型样机,但完整的设计尚未在硅上构建。该设计表明,使用GMR存储器单元,可以设计M-R存储器,使其密度和速度可与动态RAM相媲美。

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