New ideas run thermal and emission simulations together

摘要

Requirements for thermal and electromagnetic i compatibility often 1 butt heads. Here's how to reconcile the differences. Cooling analysis for electronic enclosures is well accepted. It's used by most OEMs of electronic equipment and component suppliers in early design stages to identify thermal-management issues and correct them at relatively low cost. Electromagnetic compatibility, on the other hand, is still usually addressed with easily misapplied rules of thumb that break down as designs move to higher frequencies. The result is that 70 to 90% of new designs fail first-time electromagnetic-compatibility (EMC) testing, producing high late-stage design costs and often even higher lost revenues when the product ships late.