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Grinding of Ceramics: Strength, Surface Features and Grinding Conditions

机译:陶瓷研磨:强度,表面特征和研磨条件

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摘要

The strength dependence of ceramics on microstructure, surface features and grinding conditions were studied in this work. A SiC and three l2Ce-TZPs with different grain sizes were ground under specific grinding conditions using two diamond-grinding machines. The normal grinding force increases with table speed, depth of cut and removal rate. Examination of the surface features show that the surface roughness in SiC and l2Ce-TZPs and the stress-induced t-m transformation in the l2Ce-TZPs strongly depend on the grinding conditions. The bending strength of the l2Ce-TZP with smaller grain size is not sensitive to the imposed grinding conditions. The strength of the l2Ce-TZP with the largest grain size and the SiC, however, is more sensitive to the grinding conditions. For the l2Ce-TZPs the grain size and the amount of the stress-induced t-m transformation dominate their strength.
机译:在这项工作中研究了陶瓷的强度对显微组织,表面特征和研磨条件的依赖性。使用两台金刚石研磨机在特定的研磨条件下研磨了SiC和三种不同晶粒度的l2Ce-TZP。法向磨削力随工作台速度,切削深度和去除率的增加而增加。对表面特征的检查表明,SiC和12Ce-TZPs中的表面粗糙度和12Ce-TZPs中应力引起的t-m转变在很大程度上取决于磨削条件。具有较小晶粒尺寸的l2Ce-TZP的弯曲强度对施加的研磨条件不敏感。但是,具有最大晶粒尺寸的l2Ce-TZP和SiC的强度对研磨条件更为敏感。对于12Ce-TZPs,晶粒尺寸和应力诱导的t-m转变量决定了它们的强度。

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