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Micromechanical modeling of grain boundary resistance to cleavage fracture propagation

机译:晶界抵抗劈裂裂纹扩展的微力学模型

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摘要

A micromechanical model representing two adjacent grains is developed. Rapid crack propagation from one grain into another driven by a constant global stress state is simulated. The normal of the crack face in the grain where the micro-crack initiates coincides with the principle loading direction. In the adjacent grain, the propagation direction changes and separation occurs in a mixed way, involving both normal and shear separation. The largest grain size that can arrest a rapidly propagating micro-crack is defined as the critical grain size. The effects of the global stress state and temperature on the critical grain size is examined. The influence of the mismatch in lattice orientation between two neighboring grains is qualitatively described. The influence of temperature is modeled by a temperature dependent viscoplastic response.
机译:建立了代表两个相邻晶粒的微机械模型。模拟了在恒定的整体应力状态下,裂纹从一个晶粒快速传播到另一个晶粒的过程。微裂纹产生的晶粒中裂纹面的法线与主载荷方向一致。在相邻的谷物中,传播方向发生变化,并且分离以混合方式发生,包括法向和剪切分离。可以阻止迅速扩展的微裂纹的最大晶粒尺寸定义为临界晶粒尺寸。研究了整体应力状态和温度对临界晶粒尺寸的影响。定性地描述了两个相邻晶粒之间晶格取向不匹配的影响。温度的影响通过温度依赖性粘塑性响应来建模。

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