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Simulation of Thermal Protrusions on Magnetic Head Elements

机译:磁头元件上热突起的模拟

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摘要

Under recent low flying height conditions of magnetic head sliders, both the heat generated by the high-frequency current in the write coils and the rise in the ambient temperature cause local protrusion on head elements. Such protrusion reduces the flying height below the design value, thus reducing the safety margin for head/disk interference. To analyze this problem, we numerically simulated the heat transfer in the head slider, the thermal deformation of the head, and the flying height changes of the slider due to the deformation. The typical temperature distribution obtained from the simulation agrees well with reported experimental results. The simulation results show that decreasing the alumina base coat thickness can reduce the magnitude of a protrusion. For write-current-induced protrusions, the reduced flying height is partly compensated by increased air pressure on the air-bearing surface. However, almost the entire magnitude of an ambient-temperature-induced protrusion translates into flying height reduction.
机译:在最近的磁头滑动器的低飞行高度条件下,写线圈中的高频电流产生的热量和环境温度的升高都会在磁头元件上引起局部突出。这种突出将浮动高度降低到设计值以下,从而降低了磁头/磁盘干扰的安全裕度。为了分析该问题,我们对磁头滑块中的传热,磁头的热变形以及由于变形而引起的滑块的浮动高度变化进行了数值模拟。从模拟获得的典型温度分布与报道的实验结果非常吻合。仿真结果表明,减小氧化铝底涂层的厚度可以减小突起的大小。对于写电流引起的突起,减小的飞行高度可通过空气轴承表面上气压的增加来部分补偿。然而,环境温度引起的突起的几乎整个大小都转化为飞行高度的减小。

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