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首页> 外文期刊>Journal of Wood Science >Bond durability of kenaf core binderless boards I: two-cycle accelerated aging boil test
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Bond durability of kenaf core binderless boards I: two-cycle accelerated aging boil test

机译:洋麻芯无粘结剂板的粘结耐久性I:两周期加速老化沸腾试验

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摘要

A two-cycle accelerated aging boil test was conducted on kenaf core binderless boards to estimate their bond durability. This is one of the methods to estimate the bond quality of kenaf core binderless boards, as stipulated by Notification 1539 of the Ministry of Land, Infrastructure, and Transport, October 15, 2001, for the Building Standard Law of Japan. Generally, retention ratios of modulus of rupture (MOR), modulus of elasticity (MOE), and internal bond (IB) strength after the boil test increased with increased pressing temperature. In particular, the MOR retention ratio of boards with a pressing temperature of 200°C (average 106.4%) was higher than that of a commercial medium-density fiberboard (MDF) (melamine-urea-formaldehyde resin) (average 72.7%), and the value sometimes exceeded 100%. The durability of kenaf core binderless boards with a pressing temperature of 200°C compared favorably with that of the commercial MDF (melamine-urea-formaldehyde resin), having almost the same retained strength values after the boil test.
机译:在洋麻芯无粘结剂板上进行了两个周期的加速老化沸腾测试,以评估其粘结耐久性。根据日本国土交通省2001年10月15日第1539号通知中的规定,这是估算洋麻芯无粘结剂木板粘结质量的一种方法。通常,煮沸试验后的断裂模量(MOR),弹性模量(MOE)和内部键合(IB)强度的保留率随加压温度的升高而增加。特别是,压制温度为200°C(平均106.4%)的木板的MOR保留率高于商业中密度纤维板(MDF)(三聚氰胺-脲-甲醛树脂)的MOR保留率(平均72.7%),有时值会超过100%。压制温度为200°C的洋麻芯无粘合剂板的耐久性与商用MDF(蜜胺-脲-甲醛树脂)的耐久性相比具有优势,在沸腾试验后具有几乎相同的保留强度值。

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