Transient thermal singular stresses of multiple cracking in a W-Cu Functionally graded divertor plate

摘要

We consider the transient thermal singular stresses of multiple cracking in a func- tionally graded divertor plate due to a thermal shock. The plate is made of a graded layer bonded between a homogeneous substrate and a homogeneous coating, and it is subjected to a cycle of heating and cooling on the coating surface of the plate. The surface layer contains a parallel array of embedded or edge cracks perpendicular to the boundaries. The thermal and elastic properties of the material are dependent on the temperature and the position. Finite element calculations are carried out, and the transient thermal stress intensity factors are shown graphically.