首页> 外文期刊>Journal of thermal stresses >THERMO-MECHAIMICAL BENDING OF FUNCTIONALLY GRADED PLATES
【24h】

THERMO-MECHAIMICAL BENDING OF FUNCTIONALLY GRADED PLATES

机译:功能梯度板的热力学弯曲

获取原文
获取原文并翻译 | 示例
       

摘要

In this work the deformations of a simply supported, functionally graded, rectangular plate subjected to thermo-mechanical loadings are analysed, extending Unified Formulation by Carrera. The governing equations are derived from the Principle of Virtual Displacements accounting for the temperature as an external load only. The required temperature field is not assumed a priori, but determined separately by solving Fourier's equation. Numerical results for temperature, displacement and stress distributions are provided for different volume fractions of the metallic and ceramic constituent as well as for different plate thickness ratios. They correlate very well with three-dimensional solutions given in the literature.
机译:在这项工作中,分析了承受热机械载荷的简单支撑的,功能渐变的矩形板的变形,从而扩展了Carrera的统一配方。控制方程式是根据“虚拟位移原理”得出的,该原理仅将温度视为外部负载。所需的温度场不是先验的,而是通过求解傅立叶方程式单独确定的。针对金属和陶瓷成分的不同体积分数以及不同的板厚比,提供了温度,位移和应力分布的数值结果。它们与文献中给出的三维解非常相关。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号