Thermoelastic processes analyzer for piecewise homogeneous conductive structures subjected to pulsed electromagnetic actions

摘要

A mathematical model is suggested for the determination of thermal stress state, load-bearing capacity, and properties of a contact joint of the components of a piecewise homogeneous conductive solid under the action of pulsed electromagnetic fields. The basic relationships of thermomechanics for such a solid are presented in terms of displacements and stresses. The boundary conditions are formulated for the key functions both at the outer surfaces of the solid and at the surfaces of its components contact.