Skin pain sensation of epidermal electronic device/skin system considering non-Fourier heat conduction

摘要

Epidermal electronic devices (EEDs) have drawn much attention recently due to their wide applications in biological monitoring and biomedicine. Due to the thermo-mechanical coupling between EEDs and skin, skin pain sensation is susceptive to noxious stimuli from EEDs in practical applications. An analytical thermo-mechanical model is developed to predict the temperature and stress distributions in the EED/skin system accounting for the non-Fourier effect in skin tissues via Dual-Phase-Lag (DPL) model. The phase lag parameters in the DPL model are obtained from the two-temperature model and then validated by experiments. The holistic analytical frame, consisting of the thermo-mechanical model for temperature and stress, Arrhenius burn model for thermal damage, modified Hodgkin-Huxley model for nociceptor transduction and gate control theory for pain modulation and perception, is adopted to quantify the skin pain sensation in terms of the noxious stimuli from EEDs. Skin pain sensations of EED/skin system are fully investigated in both constant and periodic operation modes. The model in this paper paves the theoretical foundation to study wearing comfort of EEDs and can be easily extended to study other bio-integrated systems for different types of applications.