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A micromechanical model of hardening, rate sensitivity and thermal softening in bcc single crystals

机译:bcc单晶中硬化,速率敏感性和热软化的微力学模型

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The present paper is concerned with the development of a micromechanical model of the hardening, rate-sensitivity and thermal softening of bcc crystals. In formulating the model, we specifically consider the following unit processes: double-kink and formation and thermally activated motion of kinks; the close-range interactions between primary and forest dislocations, leading to the formation of jogs; the percolation motion of dislocations through a random array of forest dislocations introducing short-range obstacles of different strengths; dislocation multiplication due to breeding by double cross-slip; and dislocation pair annihilation.
机译:本文涉及密件抄送晶体的硬化,速率敏感性和热软化的微力学模型的发展。在建立模型时,我们特别考虑以下单元过程:双扭结和扭结的形成和热激活运动;原始错位与森林错位之间的近距离相互作用,导致慢跑的形成;错位的渗流运动通过随机排列的森林错位阵列引入不同强度的短距离障碍物;错位倍增是由于双交滑移引起的;和位错对an灭。

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