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Thermomechanical behavior of thermoset shape memory polymer programmed by cold-compression: Testing and constitutive modeling

机译:通过冷压编程的热固性形状记忆聚合物的热力学行为:测试和本构模型

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Programming is a key process for thermally activated stress or strain recovery of shape memory polymers (SMPs). Typically, programming requires an initial heating above the glass transition temperature (T_g), subsequent cooling below T_g and removal of the applied load, in order to fix a temporary shape. This work adopted a new approach to program thermoset SMPs directly at temperatures well below T_g, which effectively simplified the shape fixing process. 1-D compression programming below T_g and free shape recovery of a thermoset SMP were experimentally investigated. Functional stability of the shape fixity under various environmental attacks was also experimentally evaluated. A mechanism-based thermoviscoelastic-thermoviscoplastic constitutive model incorporating structural and stress relaxation was then developed to predict the nonlinear shape memory behavior of the SMP trained below T_g. Comparison between the prediction and the experiment showed good agreement. The structure dependence of the thermomechanical behavior of the SMP was further discussed through a parametric study per the validated constitutive model. This study validates that programming by cold-compression is a viable alternative for thermally responsive thermoset SMPs.
机译:编程是形状记忆聚合物(SMP)的热激活应力或应变恢复的关键过程。通常,编程需要将初始加热加热到玻璃化转变温度(T_g)以上,然后将其冷却到T_g以下,并除去施加的负载,以固定临时形状。这项工作采用了一种新方法来直接在远低于T_g的温度下对热固性SMP进行编程,从而有效简化了形状固定过程。实验研究了T_g以下的一维压缩程序和热固性SMP的自由形状恢复。还通过实验评估了形状固定在各种环境攻击下的功能稳定性。然后建立了一种基于机理的热粘弹性-热塑塑性本构模型,该模型结合了结构和应力松弛,以预测在T_g以下训练的SMP的非线性形状记忆行为。预测与实验之间的比较显示出良好的一致性。根据验证的本构模型,通过参数研究进一步讨论了SMP热力学行为的结构依赖性。这项研究证实了通过冷压编程是热响应热固性SMP的可行替代方案。

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