首页> 外文期刊>Journal of the American Chemical Society >Influence of Defects on the Electrical Characteristics of Mercury-Drop Junctions: Self-Assembled Monolayers of n-Alkanethiolates on Rough and Smooth Silver
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Influence of Defects on the Electrical Characteristics of Mercury-Drop Junctions: Self-Assembled Monolayers of n-Alkanethiolates on Rough and Smooth Silver

机译:缺陷对汞滴结的电学特性的影响:粗糙和光滑的银上正构烷硫醇盐的自组装单分子层

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This paper compares the structural and electrical characteristics of self-assembled monolayers (SAMs) of n-alkanethiolates, SC_n (n = 10,12,14), on two types of silver substrates: one used as-deposited (AS-DEP) by an electron-beam evaporator, and one prepared using the method of template-stripping. Atomic force microscopy showed that the template-stripped (TS) silver surfaces were smoother and had larger grains than the AS-DEP surfaces, and reflectance-absorbance infrared spectroscopy showed that SAMs formed on TS substrates were more crystalline than SAMs formed on AS-DEP substrates. The range of current densities, J (A/cm~2), measured through mercury-drop junctions incorporating a given SAM on AS-DEP silver was, on average, several orders of magnitude larger than the range of J measured through the same SAM on TS silver, and the AS-DEP junctions failed, on average, 3.5 times more often within five current density-voltage (J— V) scans than did TS junctions (depending on the length of the alkyl chains of the molecules in the SAM). The apparent log-normal distribution of J through the TS junctions suggests that, in these cases, it is the variability in the effective thickness of the insulating layer (the distance the electron travels between electrodes) that results in the uncertainty in J. The parameter describing the decay of current density with the thickness of the insulating layer, β, was either 0.57 A~(-1) at V= +0.5 V (calculated using the log-mean of the distribution of values of J) or 0.64 A~(-1) (calculated using the peak of the distribution of values of J) for the TS junctions; the latter is probably the more accurate. The mechanisms of failure of the junctions, and the degree and sources of uncertainty in current density, are discussed with respect to a variety of defects that occur within Hg-drop junctions incorporating SAMs on silver.
机译:本文比较了在两种类型的银基板上,正链烷硫醇盐SC_n(n = 10,12,14)的自组装单分子层(SAMs)的结构和电学特征:一种是按原样使用沉积(AS-DEP)电子束蒸发器,并使用模板剥离法制备。原子力显微镜显示,剥离了模板的(TS)银表面比AS-DEP表面更光滑,并且晶粒更大,而反射吸收红外光谱表明,在TS基板上形成的SAM比在AS-DEP上形成的SAM更结晶。基材。通过在AS-DEP银上结合给定SAM的汞滴结测量的电流密度范围J(A / cm〜2)平均比通过相同SAM测量的J范围大几个数量级在TS银上,并且在五个电流密度-电压(JV)扫描中,AS-DEP结平均失败的次数是TS结的3.5倍(取决于SAM中分子的烷基链的长度) )。 J通过TS结的表观对数正态分布表明,在这些情况下,绝缘层有效厚度的变化(电子在电极之间传播的距离)导致J的不确定性。描述电流密度随绝缘层厚度β的衰减在V = +0.5 V时为0.57 A〜(-1)(使用J值分布的对数平均值计算)或0.64 A〜 (-1)(使用J值的分布峰值计算)的TS结;后者可能更准确。关于在银上结合了SAM的Hg-drop结中发生的各种缺陷,讨论了结的失效机理以及电流密度的不确定度和来源。

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