LOW-κ MATERIALS: TESTING RESISTANCE TO ELECTRICAL BREAKDOWN

摘要

In the semiconductor industry, silicon dioxide (SiO_2) is currently the most widely used insulating material. Low-κ materials, that is, those with a dielectric constant, κ, lower than that of SiO_2, are advantageous because they permit the use of thinner insulation layers, increasing the packing density of semiconductor components on a chip. However, a lower dielectric constant comes at a price: such materials are more susceptible to breakdown under an electric field.