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首页> 外文期刊>Journal of Quantitative Spectroscopy & Radiative Transfer >DIELECTRONIC RECOMBINATION OF Ni-, Cu-, AND Ar-LIKE TUNGSTEN AND BARIUM THROUGH THE LOW INNER-SHELL EXCITED CONFIGURATIONS INCLUDING COLLISION PROCESSES
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DIELECTRONIC RECOMBINATION OF Ni-, Cu-, AND Ar-LIKE TUNGSTEN AND BARIUM THROUGH THE LOW INNER-SHELL EXCITED CONFIGURATIONS INCLUDING COLLISION PROCESSES

机译:镍,铜和氩样钨和钡通过低内壳激发构型包括碰撞过程的介电重组

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摘要

Level-by-level relativistic calculations of dielectronic recombination (DR) cross sections and rate coefficients for Ni-, Cu-, and Ar- like tungsten in the ground state were performed. Similar calculations were carried out for Ni-like barium for comparison. The most important low-lying inner-shell excited configuration complexes are taken into account, namely (3p3d)~154141′ for Ni-like W and Ba, (3p3d)~154s4141′ for Cu-like W, and finally 3p~53d91, 3s3p~63d71, and 3p~54141′ for Ar-like W. These complexes give the dominant contributions to the total DR rate coefficients for kT_e < 0.5 keV, and are still expected to give major contributions at higher electron temperature. Configuration mixing is taken into account when significant.
机译:进行了基态下镍,铜和氩样钨的双电子复合(DR)截面的逐级相对论计算和速率系数。为了进行比较,对类似镍的钡进行了类似的计算。考虑到最重要的低位内壳激发构型配合物,对于Ni类的W和Ba为(3p3d)〜154141',对于Cu类的W为(3p3d)〜154s4141',最后是3p〜53d91, 3s3p〜63d71和3p〜54141'(类似Ar的W)。这些配合物对kT_e <0.5 keV的总DR速率系数起主要作用,并且仍有望在较高电子温度下起主要作用。重要时,将考虑配置混合。

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