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首页> 外文期刊>Journal of power electronics >Optimization of an automotive power semiconductor switch module using inlay PCB technology
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Optimization of an automotive power semiconductor switch module using inlay PCB technology

机译:使用镶嵌PCB技术的汽车功率半导体开关模块的优化

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摘要

An optimization approach for automotive power semiconductor switch module with shunt resistor using an inlay printed circuit board (PCB) is proposed in this study to analyze electrical and thermal characteristics under a given maximum temperature rise constraint. The final module with a shunt resistor and current measurement block is designed and manufactured by adopting the optimization results. The performance is measured and compared with a conventional module without a shunt resistor, which was manufactured before optimizing. The number of MOSFETs used in the module decreased from six to four while satisfying a maximum temperature rise of 20 degrees C. Therefore, optimization increases the price competitiveness of the power module.
机译:本研究提出了一种使用镶嵌印刷电路板(PCB)具有分流电阻器的汽车电力半导体开关模块的优化方法,分析给定的最大温度升高约束下的电气和热特性。具有分流电阻和电流测量块的最终模块通过采用优化结果而设计和制造。测量性能,并与传统模块进行比较,没有分流电阻,在优化之前制造。模块中使用的MOSFET的数量从六到四个减少,同时满足20摄氏度的最高温度升高。因此,优化增加了电源模块的价格竞争力。

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