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Evaluation of Soft-Delay-Error Effects in Content-Addressable Memory

机译:内容可寻址存储器中软延迟错误影响的评估

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In recent technology nodes, a timing-error issue due to particle strike into semiconductor materials is getting critical. This paper evaluates a soft-delay-error (SDE) effect due to particle strike for soft-error tolerant content-addressable memories (CAMs). The SDE is that a particle strike into semiconductor materials induces a transient pulse signal, causing a delay variation and a timing error of an integrated circuit. The delay variation is evaluated using a charge-injection model at a transistor level for two different CAMs. One of the CAMs is a traditional 9-transistor-cell based CAM and the other is a magnetictunnel-junction (MTJ)/MOS hybrid cell based CAM that operates based on a multiple-valued current-mode logic. These two CAMs are simulated using a SPICE simulator that can handle both transistors and MTJ devices in a 90nm CMOS/100nm MTJ technology. Based on the simulation results, circuit architectures and design parameters are discussed in order to design soft-error tolerant CAMs.
机译:在最近的技术节点中,由于粒子撞击半导体材料而引起的定时误差问题变得越来越关键。本文针对容忍软错误的内容可寻址存储器(CAM)评估了由于粒子撞击而引起的软延迟错误(SDE)效果。 SDE指的是撞击到半导体材料中的粒子会引起瞬态脉冲信号,从而引起集成电路的延迟变化和时序误差。对于两个不同的CAM,使用电荷注入模型在晶体管级别评估延迟变化。 CAM中的一个是传统的基于9晶体管单元的CAM,另一个是基于磁隧道结(MTJ)/ MOS混合单元的CAM,其基于多值电流模式逻辑进行操作。这两个CAM使用SPICE仿真器进行仿真,该仿真器可以使用90nm CMOS / 100nm MTJ技术处理晶体管和MTJ器件。基于仿真结果,讨论了电路架构和设计参数,以设计可容忍软错误的CAM。

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