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Effects of layers and vias on continuous-wave laser heating and damage of surface-micromachined structures

机译:层和通孔对连续波激光加热和表面微加工结构损坏的影响

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摘要

The response of microsystem components to laser irradiationnis relevant to processes and applications such as laser processing, op-ntical diagnostics, and optical microelectromechanical systems u0001MEMSu0002ndevice design and performance. The dimensions of MEMS, which are onnthe order of several micrometers, are on the same order as infrared lasernwavelengths, which results in interference phenomena when the partsnare partially transparent. Four polycrystalline silicon structures were de-nsigned and irradiated with 532 and 808 nm continuous wave laser lightnto determine the effects of layers, air gaps, and the presence of a sub-nstrate via on the threshold laser power for damage. The presence of ansubstrate via resulted in lower damage thresholds, and a single-layernstructure had the highest damage threshold for structures irradiated withninfrared light. Structures irradiated with visible wavelength light exhibitednless sensitivity to the underlying via. Optical interference calculations arencarried out to evaluate the absorptance of these structures as a feasiblenexplanation for the observed results. ©
机译:微系统组件对激光辐照的响应与诸如激光加工,光学诊断以及光学微机电系统的设计和性能等工艺和应用有关。 MEMS的尺寸约为几微米,与红外激光波长处于同一数量级,当零件部分透明时会导致干涉现象。设计四个多晶硅结构,并用532和808 nm连续波激光束照射,以确定层,气隙和子基板通孔的存在对阈值激光功率的影响。基板通孔的存在导致较低的损伤阈值,而单层结构对于用红外光照射的结构具有最高的损伤阈值。用可见光波长照射的结构对下面的过孔不表现出敏感性。进行光学干涉计算以评估这些结构的吸收率,作为对观察结果的可行解释。 ©

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