Recent advances on SnBi low-temperature solder for electronic interconnections

摘要

SnBi lead-free solder is widely applied in the field of low-temperature soldering due to its excellent creep resistance, relatively low melting point (139°C) and cost. However, the frangibility and poor ductility of the SnBi low-temperature solder limits its application in the field of electronic packaging. In this paper, the research progress and development direction of SnBi low-temperature lead-free solder are discussed. To promote the application of SnBi solder, the melting characteristics, wettability, microstructure, tensile properties, shear properties, creep properties and interfacial reaction of SnBi solder are analyzed and introduced systematically. It provides an important reference of understanding the current development of SnBi solders.