Irregular Characteristics of Bond Interface Formation in Ultrasonic Wire Wedge Bonding

摘要

The mechanism of ultrasonic wire wedge bonding, one of the die/chip interconnection methods, was investigated based on the characteristics of the ultrasonic wire bonding joints. The AI-1 percent Si wire of 25 mum in diameter was bonded on Au/Ni/Cu pad and the joint cross-section was analyzed by scanning electron microscopy (SEM) and energy-dispersive X-ray spectroscopy (EDX). The results indicated that it is irregular for the ultrasonic bond formation, non-welded at the centre but joining well at the periphery, especially at the heel and toe of the joint. Furthermore, the diffusion and/or reaction at the cross-section interface are not clear at C-zone, while there exists a strip layer microstructure at P-zone, and the composition is 78.96 at. pct Al and 14.88 at. pct Mi, close to the AI_3Ni intermetallic compound. All these observations are tentatively ascribed to the plastic flow enhanced by ultrasonic vibration and repeated cold deformation driving interdiffusion between Al and Ni at bond interface.