Spelling of intermetallic compounds during the reaction between lead-free solders and electroless Ni-P metallization

摘要

Intermetallic compound (IMC) spalling from electroless Ni-P film was investigated with lead-free solders in terms of solder-deposition methods (electroplating, solder paste, and thin foil), P content in the Ni-P film (4.6, 9, and 13 wt percent P), and solder thickness (120 versus .200 mu m). The reaction of Ni-P with Sn3.5Ag paste easily led to IMC spalling after 2-min reflow at 250 deg C while IMCs adhered to the Ni-P layer after 10-min reflow with electroplated Sn or Sn3.5Ag. It has been shown that not only the solder composition but also the deposition method is important for IMC spalling from the Ni-P layer. The spalling increased with P content as well as with solder volume. Ni_3Sn_4 intermetallics formed as a needle-shaped morphology at an early stage and changed into a chunk-shape. Needle-shaped compounds exhibited a higher propensity for spalling than chunk-shaped compounds because many channels among the needle-shaped IMCs facilitated Sn penetration. A reaction between the penetrated Sn and the Ni_3P layer formed a Ni_3SnP layer and Ni_3Sn_4 IMCs spalled off the Ni_3SnP surface. Dewetting of solder from the Ni_3SnP layer, however, did not occur even after spalling of most IMCs.