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首页> 外文期刊>Journal of Manufacturing Processes >Shear compaction processing of SiC nanoparticles reinforced magnesium composites directly from magnesium chips
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Shear compaction processing of SiC nanoparticles reinforced magnesium composites directly from magnesium chips

机译:直接从镁屑切碎压缩SiC纳米颗粒增强镁复合材料

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In this work, a novel synthesis technique, shear compaction processing (SCP), is developed to produce magnesium (Mg) based composite from Mg machining chips and nano-sized silicon carbide (SiC) particulates reinforcement. During the process, Mg machining chips are first loaded into the container and slightly compacted, and then SiC nanoparticles are added on top of the compacted Mg chips. A scroll faced rotating tool with a designated diameter is plunged into the Mg chips at a selected spindle rotation speed and feed rate. Due to the huge amounts of heat generation, the softened materials are compressed and synthesized to form a nanocomposite disk eventually. The results show that the SCP process is a feasible solution for producing a void-free bulk nanocomposite material directly from Mg chips and SiC nanoparticles in a single step. The microstructural analysis with optical microscopy and scanning electron microscopy clearly shows the significant grain refinement in the produced nanocomposite disk. The reinforcement of nanoparticles is uniformly distributed in the mixed domain. Good interfacial bonding is captured between the matrix and SiC nanoparticles. The produced specimen has a higher hardness than the parent material, and also exhibits excellent wear resistance. The significant improvement is attributed to the resulting fine-grained microstructure and homogenous distribution of SiC nanoparticles throughout the matrix material of Mg, due to severe plastic deformation and mixing during the SCP process. (C) 2016 The Society of Manufacturing Engineers. Published by Elsevier Ltd. All rights reserved.
机译:在这项工作中,开发了一种新颖的合成技术,即剪切压实处理(SCP),以利用镁加工芯片和纳米尺寸的碳化硅(SiC)颗粒增强材料来生产基于镁(Mg)的复合材料。在此过程中,首先将Mg切削屑装入容器中并稍稍压紧,然后将SiC纳米颗粒添加到压紧的Mg屑顶部。将具有指定直径的滚动面旋转刀具以选定的主轴转速和进给速率插入Mg切屑中。由于产生大量的热量,软化的材料被压缩并合成以最终形成纳米复合材料盘。结果表明,SCP工艺是直接从Mg芯片和SiC纳米颗粒一步生产无空隙的块状纳米复合材料的可行解决方案。用光学显微镜和扫描电子显微镜进行的显微结构分析清楚地表明,所生产的纳米复合材料盘具有明显的晶粒细化。纳米颗粒的增强物均匀地分布在混合域中。在基质和SiC纳米颗粒之间捕获了良好的界面结合。所生产的试样比母材具有更高的硬度,并且还表现出出色的耐磨性。显着改善归因于在SCP加工过程中由于严重的塑性变形和混合,使得SiC纳米颗粒在Mg的整个基质材料中产生了细粒度的微观结构和均匀分布。 (C)2016年制造工程师学会。由Elsevier Ltd.出版。保留所有权利。

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