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Silicon Photonic Switch Fabrics: Technology and Architecture

机译:硅光子交换结构:技术和体系结构

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摘要

Photonic switching technologies show potential for transforming communication networks across diverse markets from long-haul to short-reach distance scales due to their large bandwidth density, high energy efficiency, and potential for low cost. In recent years, numerous outstanding advancements have been made in scaled silicon photonic switching fabrics: spanning a variety of manufacturing platforms and packaging methods, relying on different switching mechanisms, and assembled on-chip in a diverse mixture of loosely related architectures. This paper reviews the current approaches employed by leading researchers in this area, and surveys the state of the art in achieved performance at both the technological and the architectural level. Specifically, we consider thermo-optic, electro-optic, and MEMS-hased switch actuation embedded in Mach Zehnder interferometer, ring resonator, and directional coupler based silicon photonic switches. We define common metrics and compare performances. We outline critical requirements for constructing scaled switch fabrics from elementary cells. We investigate similarities and differences between a number of commonly utilized topologies. And, we survey recent accomplishments in scaled switch fabrics at the chip and package level. Moving these demonstrations from research to product will require many further advancements, and we highlight areas that we believe will be critical tier market adoption.
机译:光子交换技术因其高带宽密度,高能效和低成本潜力而具有将多种市场的通信网络从长距离转换为短距离距离规模的潜力。近年来,按比例缩放的硅光子交换结构已经取得了许多杰出的进步:跨越各种制造平台和封装方法,依靠不同的交换机制,并以松散相关架构的多种混合方式在芯片上组装。本文回顾了该领域领先研究人员目前采用的方法,并从技术和体系结构两个层面对获得的性能进行了研究。具体来说,我们考虑将热光,电光和具有MEMS的开关驱动器嵌入到Mach Zehnder干涉仪,环形谐振器和基于定向耦合器的硅光子开关中。我们定义通用指标并比较效果。我们概述了从基本单元构建缩放交换结构的关键要求。我们研究了许多常用拓扑之间的异同。并且,我们在芯片和封装级别调查了规模化交换结构的最新成就。将这些演示从研究转移到产品,将需要许多进一步的发展,我们重点介绍了我们认为对关键市场采用至关重要的领域。

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