Temperature Distributions of SMA Wires Embedded in Epoxy Resin Plates and Heated by Supplying Electric Current

摘要

As a fundamental study of a smart structure having the functions of crack prevention and crack closure, the temperature distributions of multiple shape memory alloy (SMA) wires embedded in epoxy resin plates and heated by supplying electric current are investigated using an infrared thermography technique and the finite element method (FEM). The temperature distributions of SMA in the air and of the plate surface obtained using FEM are in reasonable agreement with those obtained using the thermography technique. The numerical results show that the temperature of the SMA wire surface embedded in the plates depends on the length between SMA wires and the plate thickness, and is less than that in air.