...
首页> 外文期刊>Journal of Fuel Cell Science and Technology >Experimental Investigation on the Process-Induced Damage of a Direct Methanol Fuel Cell Assembled by the Printed Circuit Board Technique
【24h】

Experimental Investigation on the Process-Induced Damage of a Direct Methanol Fuel Cell Assembled by the Printed Circuit Board Technique

机译:印制电路板技术组装直接甲醇燃料电池过程致损伤的实验研究

获取原文
获取原文并翻译 | 示例
   

获取外文期刊封面封底 >>

       

摘要

The printed circuit board (PCB)-based direct methanol fuel cell (DMFC) package is annovel manufacturing and assembly process, which is full potential in mass production,nand very limited literatures make study on the effects of the related process parameters.nThe hot press is a necessary and key process to make the PCB package, i.e., the keyncomponent of a DMFC, membrane electrode assemblies (MEA), needs to sustain a severentest. In order to minimize the process-induced damage of the MEAs, it is important tonmake a good control on the process parameters. Therefore, the objective of this paper isnto present a methodology to explore a good combination of hot-press parameters. Thenconsidered parameters include the compression ratio of the MEA, heating time, heatingntemperature, and hot pressing pressure acting on the MEA. During the experimentalninvestigation, a series of experiments was made first to discuss the effect of the individualnparameter of the hot-press process on the MEA performance, wherein a reasonable rangenof each process parameter condition was able to be well defined. Moreover, the Taguchinexperimental method was adopted to explore the parameter effects on the DMFC performancenduring the digital packaging process and to determine the best combination ofnparameter conditions. At the end, a MEA was made a hot press under the best parameterncombination, which could verify the result obtained from Taguchi’s experiments. Thenresult is able to be an important reference for the future manufacturing design guidelinenof PCB-based DMFC package.
机译:基于印刷电路板(PCB)的直接甲醇燃料电池(DMFC)封装是一种新颖的制造和组装工艺,在大规模生产中具有充分的潜力,很少有文献研究相关工艺参数的影响。这是使PCB封装(即DMFC的关键组件,膜电极组件(MEA))需要经受严格测试的必要且关键的过程。为了最大程度地减少过程对MEA的损害,重要的是对过程参数进行良好的控制。因此,本文的目的是提出一种方法来探索热压参数的良好组合。然后考虑的参数包括MEA的压缩比,加热时间,加热温度和作用在MEA上的热压压力。在实验研究期间,首先进行了一系列实验,以讨论热压过程的各个参数对MEA性能的影响,其中可以很好地定义每个过程参数条件的合理范围。此外,采用Taguchin实验方法探讨了数字包装过程中参数对DMFC性能的影响,并确定了参数条件的最佳组合。最后,将MEA在最佳参数组合下进行热压,这可以验证Taguchi实验获得的结果。结果将成为将来基于PCB的DMFC封装设计指南的重要参考。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号