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Halide removal from water using silver doped magnetic-microparticles

机译:使用掺杂银的磁性微粒从水中去除卤化物

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This study proposes the use of new materials based on core-shell structure magnetic microparticles with Ag-0 (Ag(0)-MPs) on their surface to remove bromides and chlorides from waters intended for human consumption. Hydrogen peroxide was used as oxidizing agent, Ag(0)-MPs is thereby oxidized to Ag (I)-MPs, which, when in contact with Cl- and Br- ions, form the corresponding silver halide (AgCl and AgBr) on the surface of Ag-MPs. The concentration of Cl- and Br- ions was followed by using ion selective electrodes (ISEs). Silver microparticles were characterized by high-resolution scanning electron microscopy and X-ray photoelectron spectroscopy, while the presence of AgCl and AgBr on Ag-MPs was determined by microanalysis. We analyzed the influence of operational variables, including: hydrogen peroxide concentration in Ag-MP system, medium pH, influence of Cl- ions on Br- ion removal, and influence of tannic acid as surrogate of organic matter in the medium. Regarding the influence of pH, Br- and Cl- removal was constant within the pH range studied (3.5-7), being more effective for Br- than for Cl- ions. Accordingly, this research states that the system Ag-MPs/H2O2 can remove up to 67.01% of Br- ions and 56.92% of Cl- ions from water (pH = 7, [Ag-MPs](0) = 100 mg L-1, [H2O2](0) = 0.2 mM); it is reusable, regenerated by radiation and can be easily removed by applying a magnetically assisted chemical separation process.
机译:这项研究建议使用基于表面具有Ag-0(Ag(0)-MPs)的核-壳结构磁性微粒的新材料,以去除拟供人类食用的水中的溴化物和氯化物。过氧化氢用作氧化剂,从而将Ag(0)-MPs氧化成Ag(I)-MPs,当与Cl-和Br-离子接触时,在其上形成相应的卤化银(AgCl和AgBr)。 Ag-MPs的表面。使用离子选择电极(ISE)跟踪Cl-和Br-离子的浓度。银微粒通过高分辨率扫描电子显微镜和X射线光电子能谱进行了表征,而AgCl和AgBr在Ag-MP上的存在则通过微分析来确定。我们分析了操作变量的影响,包括:Ag-MP系统中的过氧化氢浓度,介质pH值,Cl-离子对Br-离子去除的影响以及鞣酸作为介质中有机物的替代物的影响。关于pH的影响,Br-和Cl-的去除在所研究的pH范围内是恒定的(3.5-7),对Br-的去除比对Cl-离子的去除更为有效。因此,这项研究表明,系统Ag-MPs / H2O2可以从水中去除高达67.01%的Br-离子和56.92%的Cl-离子(pH = 7,[Ag-MPs](0)= 100 mg L- 1,[H2O2](0)= 0.2 mM);它可重复使用,通过辐射再生,并且可以通过应用磁辅助化学分离工艺轻松去除。

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