OIF to Demonstrate 4 x 25G Multi-Vendor Interoperability at OFC/NFOEC

摘要

2013 MAR 20 (VerticalNews) -- By a News Reporter-Staff News Editor at Journal of Engineering -- ThenOptical Internetworking Forum is hosting a demonstration of multi-vendor operation of the 4 x 25Gnchip-to-module application as defined in the CEI-28G-VSR Implementation Agreement. The OIF'snPhysical and Link Layer demonstrations will feature for the first time interoperability including both CFP2nand QSFP28 optical modules. This is the OIF's third interoperability demonstration of 100Gb/s channelsnand includes the largest number of participating component suppliers. Also being tested fornCEI-28G-VSR interoperability are host ASICs and FPGAs with VSR SERDES, host PCB traces, opticalnmodule connectors, and module retimers. These demonstrations will be on display in Anaheim, Marchn19-21 at the OIF booth #2769.