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首页> 外文期刊>Journal of the electronics industry >Renesas Tailors Packages for Demanding Vehicle Applications
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Renesas Tailors Packages for Demanding Vehicle Applications

机译:瑞萨为高要求的车辆应用量身定制套装

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摘要

Today, the field of automotive electronics is very active as the latest vehicles make use of an increasing number of semiconductor devices. A single car may contain more than 100 microcontroller units (MCUs) (Fig. 1). Electronic components are being installed for increasingly varied applications, including those related to information and entertainment, such as navigation systems and mobile communications; body and dashboard functions, such as door and air-conditioner controls; safety, such as airbags and anti-lock braking systems; the power train, such as engine and automatic transmission controls; and the chassis, such as the suspension and power steering systems. As a result, such devices as MCUs, system-on-chips (SOCs), mixed signal devices (MSIGs), and discrete devices are being used in various package forms.
机译:如今,随着最新的汽车使用越来越多的半导体器件,汽车电子领域变得非常活跃。一辆汽车可能包含100多个微控制器单元(MCU)(图1)。正在为越来越多样化的应用程序安装电子组件,包括与信息和娱乐有关的应用程序,例如导航系统和移动通信;车身和仪表板功能,例如门和空调控制;安全,例如安全气囊和防抱死制动系统;动力总成,例如发动机和自动变速箱控制;和底盘,例如悬架和动力转向系统。结果,诸如MCU,片上系统(SOC),混合信号设备(MSIG)和分立设备之类的设备正以各种封装形式被使用。

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