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Turbulence Modeling Of Forced Convection Heat Transfer In Two-dimensional Ribbed Channels

机译:二维带肋通道强迫对流换热的湍流模型

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摘要

Although the problem of 2D ribbed channels has been studied heavily in the literature as a benchmark or basic case for cooling of electronic packing, there is still a contradiction in the literature about the suitable turbulence model that should be used in such a problem. The accuracy of the computational predictions of heat transfer rates depends mostly on the choice of the proper turbulence model that is capable of capturing the physics of the problem, and on the corresponding wall treatment. The main objective of this work is to identify the proper turbulence model to be used in thermal analysis of electronic systems. A number of available turbulence models, namely, the standard k-e, the renormalization group k-e, the shear stress transport (SST), the k-ω, and the Reynolds stress models, have been investigated. The selection of the most appropriate turbulence model has been based upon comparisons with both direct numerical simulations (DNSs) and experimental results of other works. Based on such comparisons, the SST turbulence model has been found to produce results in very good agreement with the DNS and experimental results and hence it is recommended as an appropriate turbulence model for thermal analysis of electronic packaging.
机译:尽管在文献中已经对二维带肋通道的问题进行了深入研究,以作为电子包装冷却的基准或基本案例,但是在文献中仍然存在关于应在此类问题中使用的合适湍流模型的矛盾。传热速率的计算预测的准确性主要取决于能够捕获问题物理特性的适当湍流模型的选择,以及相应的墙面处理。这项工作的主要目的是确定用于电子系统热分析的正确湍流模型。已经研究了许多可用的湍流模型,即标准k-e,重归一化组k-e,剪切应力传输(SST),k-ω和雷诺应力模型。选择最合适的湍流模型是基于与直接数值模拟(DNS)和其他工作的实验结果的比较。基于这样的比较,发现SST湍流模型产生的结果与DNS和实验结果非常吻合,因此建议将其用作电子封装热分析的合适湍流模型。

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