Discussion: 'Yield Function for Solder Elastoviscoplastic Modeling' (Dube, M., and Kundu, T., 2005, ASME J. Electron. Packag., 127, pp. 147-156)

摘要

This Discussion is submitted with the understanding that the authors would respond only to the technical issues with appropriate proofs and not address unrelated items and attack others' work. 1. The authors have employed their new yield function, Eq. (12), to plot the yield surfaces both for the compressive and tensile yields in Fig. 3, by using the same material parameters for both compression and tension behavior. Authors state that the yield function is valid for continuous yield in all directions and for continuous yield in both compression and tension.