机译:金属间特性对无卤印刷电路板组件焊点强度的影响
Department of Engineering Science, National Cheng Kung University, Tainan 70101, Taiwan;
Department of Engineering Science, National Cheng Kung University, Tainan 70101, Taiwan;
Assembly and Reliability Technology Department, Industrial Technology Research Institute, Hsinchu 31040, Taiwan;
Assembly and Reliability Technology Department, Industrial Technology Research Institute, Hsinchu 31040, Taiwan;
Department of Materials Science and Engineering, National Cheng Kung University, Tainan 70101, Taiwan;
Department of Materials Science and Engineering, National United University, Maoli 36003, Taiwan;
halogen free; lead free solder alloy; intermetallic characteristics; joint strength;
机译:高速循环弯曲测试和板级跌落测试,用于评估印刷电路板组件中焊点的坚固性
机译:高速循环弯曲测试和板级跌落测试,用于评估印刷电路板组件中焊点的坚固性
机译:具有无铅焊点的表面安装印刷电路板组件的可靠性研究
机译:金属间化合物对无卤印刷电路板组件应力分布和疲劳寿命的影响
机译:使用BGA封装的焊点可靠性评估:Megtron 6与FR4印刷电路板的跌落测试
机译:纳米粒子添加对不同热条件下Cu / Sn-Ag-Cu / Cu焊点中金属间化合物(IMCs)的形成和生长的影响
机译:印刷电路板组件的污染特性与焊接类型和保形涂层有关
机译:表面处理概述及其在印刷电路板可焊性和焊点性能中的作用;电路世界