机译:热超材料的最新进展及其电子包装未来应用
Test & System Package Samsung Electronics Hwasung 18448 South Korea;
Mechanical and Aerospace Engineering University of California Irvine Irvine CA 92617;
IBM Systems IBM Corporation Austin TX 78758;
Electronics Research Department Toyota Research Institute of North America Ann Arbor MI 48105;
Mechanical and Aerospace Engineering University of California San Diego San Diego CA 92093;
Test & System Package Samsung Electronics Hwasung 18448 South Korea;
Mechanical and Aerospace Engineering University of California Irvine Irvine CA 92617;
thermal management; electronics cooling; heat guiding; heterogeneous package;