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机译:锌的微量添加对热老化时Sn-Ag-Cu和Sn-Cu焊料与各种Cu基底的界面反应的影响
Department of Materials Science and Engineering Korea Advanced Institute of Science and Technology Gusung-Dong 373-1 Yusung-Gu Daejeon 305-701 Republic of Korea;
IBM T.J. Watson Research Center 1101 Kitchawan Road Route 134 Yorktown Heights NY 10598 USA;
IBM T.J. Watson Research Center 1101 Kitchawan Road Route 134 Yorktown Heights NY 10598 USA;
Department of Materials Science and Engineering Korea Advanced Institute of Science and Technology Gusung-Dong 373-1 Yusung-Gu Daejeon 305-701 Republic of Korea;
Zn addition; interfacial reaction; intermetallic compounds; void suppression; Cu consumption; thermal aging;
机译:锌的微量添加对热老化时Sn-Ag-Cu和Sn-Cu焊料与各种Cu基底的界面反应的影响
机译:电沉积Sn-Cu,Sn-Ag-Cu焊料与Cu,Ni基底之间的界面反应
机译:少量锌合金化改性的锡-银-铜焊料的界面反应
机译:老化对Cu之间的界面反应对Sn-9Zn无铅焊料和Au衬底的影响
机译:SN-AG-Cu焊料蠕变和断裂力学的微观结构效应
机译:微量锌对时效条件下Sn-10Bi / Cu焊点界面演变的影响
机译:sn-ag-Cu和sn-Cu焊料:与铂的界面反应