机译:环氧各向同性导电胶的电导率和导热率的温度依赖性
The Institute of Scientific and Industrial Research Osaka University 8-1 Mihogaoka Ibaraki Osaka 567-0047 Japan;
Division of Sustainable Energy and Environmental Engineering Graduate School of Engineering Osaka University 2-1 Yamadaoka Suita Osaka 565-0871 Japan;
Division of Sustainable Energy and Environmental Engineering Graduate School of Engineering Osaka University 2-1 Yamadaoka Suita Osaka 565-0871 Japan;
Division of Sustainable Energy and Environmental Engineering Graduate School of Engineering Osaka University 2-1 Yamadaoka Suita Osaka 565-0871 Japan;
The Institute of Scientific and Industrial Research Osaka University 8-1 Mihogaoka Ibaraki Osaka 567-0047 Japan;
Isotropic conductive adhesives; curing; electrical resistivity; temperature coefficient of resistivity; thermal conductivity;
机译:环氧各向同性导电胶的电导率和导热率的温度依赖性
机译:环氧树脂基各向同性导电胶的电性能对热历史的依赖性
机译:环氧树脂基各向同性导电胶的电性能对热历史的依赖性
机译:环氧树脂基粘合剂组成的各向同性导电胶电阻率的温度依赖性
机译:评估用于电子应用的导电胶的热性能和机械性能。
机译:银纳米线-银纳米粒子-石墨烯纳米片复合材料的水热法制备可提高导电胶的导电性能
机译:导电粘合剂的电气和导热率