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首页> 外文期刊>Journal of Crystal Growth >GSMBE growth and characterizations of AlInP/InGaAsP strain-compensated multiple-layer heterostructures
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GSMBE growth and characterizations of AlInP/InGaAsP strain-compensated multiple-layer heterostructures

机译:GSMBE生长和AlInP / InGaAsP应变补偿多层异质结构的表征

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摘要

We have grown long-period AlInP/InGaAsP strain-compensated multiple-layer heterostructures (SCMLHs) and SCMLHs combined with InAsP/InGaAsP strain-compensated Multiple quantum wells (SC-MQWs) by gas source molecular beam epitaxy. Etch pit density (EPD) for both structures are in magnitude of similar to 10(5) cm(-2). The increment of EPD with increase of period number is small, indicating low sensitivity of the dislocation density to the increase of period number of SCMLHs. High resolution X-ray diffraction and photoluminescence (PL) characterizations of the two structures demonstrate that crystal quality remains high due to strain compensation. Diffusion and segregation of indium were clearly observed in both InGaAsP and AllnP layers by secondary ion mass spectroscopy. As the thickness of epilayers increases In content increases, while Al decreases. PL for the structure of 20-pair AlInP/InGaAsP SCMLHs+InAsP/InGaAsP SC-MQWs shows strong luminescence and narrow line width. The strain-compensated technique can effectively suppress the formation of misfit dislocations in AlInP/InGaAsP SCMLHs although the thicknesses of epilayers are above the critical thickness of consisting materials, which may render its potential application in optoelectronic devices. (c) 2005 Elsevier B.V. All rights reserved.
机译:我们已经通过气源分子束外延生长了长周期的AlInP / InGaAsP应变补偿的多层异质结构(SCMLHs)和与InAsP / InGaAsP应变补偿的多量子阱(SC-MQWs)组合的SCMLHs。两种结构的刻蚀坑密度(EPD)大小均类似于10(5)cm(-2)。 EPD随周期数的增加而增加很小,表明位错密度对SCMLHs周期数的敏感性较低。两种结构的高分辨率X射线衍射和光致发光(PL)表征表明,由于应变补偿,晶体质量仍然很高。通过二次离子质谱在InGaAsP和AllnP层中均清楚地观察到铟的扩散和偏析。随着外延层厚度的增加,In含量增加,而Al减少。用于20对AlInP / InGaAsP SCMLHs + InAsP / InGaAsP SC-MQWs的结构的PL显示强发光和窄线宽。应变补偿技术可以有效地抑制AlInP / InGaAsP SCMLH中错配位错的形成,尽管外延层的厚度超过了组成材料的临界厚度,这可能使其在光电器件中具有潜在的应用前景。 (c)2005 Elsevier B.V.保留所有权利。

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