Temperature-dependent crosstalk and frequency spectrum analyses in adjacent interconnects of a mixed CNT bundle

摘要

This paper presents temperature-dependent circuit modeling and performance analyses of single as well as capacitively coupled interconnects of a mixed CNT bundle (MCB) with consideration of the tunneling effect at temperatures from 300 to 500 K at the 14-nm technology node. Four possible MCB structures, viz. MCB-1, MCB-2, MCB-3, and MCB-4, are considered, and their results are compared with those for a copper-based interconnect at the same technology node. For the single line architecture, as the temperature is increased from 300 to 500 K, MCB-4 exhibits a shorter propagation delay in comparison with the other MCBs (1-3) and copper. The results of the frequency spectrum analysis reveal that MCB-4 exhibits a 17.70% wider bandwidth than its copper counterpart. Also, the bandwidth of MCB-4 decreases with increasing temperature, indicating greater signal loss at higher temperatures. For the coupled line architecture, considering different switching conditions of the aggressor and victim lines, MCB-4 exhibits a shorter average dynamic crosstalk-induced delay compared with the other MCBs (1-3) or copper. In comparison with the odd mode of switching, MCB-4 exhibits a 36.45% shorter crosstalk-induced delay with the even mode of switching when the temperature is varied from 300 to 500 K. Similarly, the functional crosstalk noise levels in terms of the overshoot, undershoot, rise glitch, and fall glitch are also found to be significantly lower for MCB-4 compared with the other MCBs (1-3) or copper. The results of the simulations further reveal that MCB-4 exhibits frequency noise components with 70.66% lower amplitude compared with copper, which means that MCB-4 filters more noise components than copper. Furthermore, the amplitude of the frequency noise components increases with rise in temperature.