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Cleaner production of thermal insulation boards utilizing buffing dust waste

机译:利用抛光粉尘清洁生产隔热板

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Buffing dust waste/polystyrene bundling insulating composite is developed. Different proportions of buffing dust (from 5 wt% up to 25 wt %.) were used. The blends were mixed using co-twine extruder prior exposing it to heat and pressure using hot press machine. The thermal, physical and mechanical properties of the composites were investigated. The prepared insulation composites display a better thermal performance than pure polystyrene insulation boards. This study shows that, adding of 10 wt % buffing dust to polystyrene composites reduces the thermal conductivity of the insulation board by 13%. All prepared composites have superior thermal conductivity (0.044-0.056 W/m-K), compression strength (11.55-8.23 MPa) and flexural strength (29.51-10.53 MPa) compared to conventional bundling thermal insulation materials without degrading the mechanical properties. Chemical treatment was applied to the buffing dust filler to improve the composite integrity. Thermogravimetric and FTIR analyses were used to study the effect of the chemical treatment of the fillers. The findings of this work prove that the developed composite can be used as an alternative insulating material in building sector. In addition, it reduces the environmental impact of both buffing hazardous waste and polystyrene and the used recycling solution contributes to the fulfilment of united nation sustainable development goals and cleaner production building insulation boards. (C) 2019 Elsevier Ltd. All rights reserved.
机译:开发出抛光粉尘/聚苯乙烯束状绝缘复合材料。使用了不同比例的抛光粉(从5 wt%到25 wt%。)。使用共捻挤出机将共混物混合,然后使用热压机将其暴露于热和压力下。研究了复合材料的热,物理和机械性能。所制备的绝缘复合材料显示出比纯聚苯乙烯绝缘板更好的热性能。这项研究表明,向聚苯乙烯复合材料中添加10 wt%的抛光粉会使隔热板的导热率降低13%。与传统的捆绑隔热材料相比,所有制备的复合材料均具有优异的导热率(0.044-0.056 W / m-K),抗压强度(11.55-8.23 MPa)和抗弯强度(29.51-10.53 MPa),而不会降低机械性能。对抛光粉尘填料进行化学处理以改善复合材料的完整性。使用热重分析和FTIR分析来研究填料化学处理的效果。这项工作的结果证明,开发的复合材料可以用作建筑领域的替代绝缘材料。此外,它减少了抛光危险废物和聚苯乙烯对环境的影响,并且使用过的回收解决方案有助于实现联合国的可持续发展目标和清洁生产建筑物的隔热板。 (C)2019 Elsevier Ltd.保留所有权利。

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