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Dewetting of Au and AuPt alloy films: A dewetting zone model

机译:Au和AuPt合金膜的去湿:去湿区模型

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When thin metal films are annealed they can degrade into particles. This happens even at annealing temperatures below the melting point and is known as solid-state dewetting or agglomeration. The solid-state dewetting behaviour of 15–35?nm thick Au and 20?nm thick AuPt films on SiNx/SiO2/Si substrates was investigated in the temperature range of 500–900?°C in air. Morphology maps were created based on which a dewetting zone model is proposed. The morphology maps can be divided into three zones: a zone where the film remains continuous, a zone where dewetting takes place, and a zone where dewetting is complete. Coverage measurements can be used to determine zone boundaries and the activation energy for void growth, which was 1.05?±?0.1?eV in the case of Au. The influence of film thickness and alloying on the dewetting behaviour was studied; both factors had only an influence at low annealing temperatures, with the influence of alloying being more pronounced than the influence of film thickness.
机译:当金属薄膜退火时,它们会降解成颗粒。即使在低于熔点的退火温度下也会发生这种情况,这被称为固态去湿或结块。在温度范围内研究了SiN x / SiO 2 / Si衬底上15-35?nm厚的Au和20?nm厚的AuPt膜的固态去湿行为空气中温度为500–900?C。创建了形态图,并据此提出了反润湿区模型。形态图可分为三个区域:薄膜保持连续的区域,发生去湿的区域和完成去湿的区域。覆盖率测量可用于确定区域边界和空洞生长的活化能,在Au的情况下为1.05?±?0.1?eV。研究了膜厚和合金化对反润湿行为的影响;这两个因素仅在低退火温度下产生影响,合金化的影响比膜厚的影响更为明显。

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