Metal particle compaction during drop-substrate impact for inkjet printing and drop-casting processes

摘要

Direct coating methods using metal particles from aqueous solutions or solvent-based inks become central in the roll-to-roll fabrication processes as these methods can lead to continuous or predefined conductive layers on a large variety of substrates. For good electrical conductivity, the metal particles have to be brought into contact, and traditionally, additional sintering treatments are required. Such treatments can degrade the sensitive substrates as paper or polymer films. In this study, the possibility of obtaining conductive layers at room temperature is investigated for direct coating methods with an emphasis on drop-casting and inkjet printing. Thus, it is shown that electrical conductive layers can be achieved if the metal particles can compact during the drop-substrate impact interaction. It is theoretically shown that the compaction process is directly related to the particle and ink drop size, the initial fractional particle loading of the ink, solvent viscosity, and drop velocity. The theoretical predictions on compaction are experimentally validated, and the particle compaction's influence on changes in the electrical conductivity of the resulting layers is demonstrated.