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Effect of water vapor on the thermal resistance between amorphous silica nanoparticles

机译:水蒸气对无定形二氧化硅纳米粒子之间热阻的影响

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摘要

Nanoparticle-based materials are of interest because of their unique thermal properties. Possessing the lowest thermal conductivities of any solid materials known, they have been widely used as insulating materials. However, the presence of water vapor has been shown to have a large influence on those properties. In this work, we investigate the effect of water vapor on the heat transfer between nanoparticles using non-equilibrium molecular dynamics simulations. We calculate the absolute thermal resistance and Kapitza resistance between adjacent amorphous spherical silica nanoparticles, when water molecules are allowed to diffuse as vapor into the interstitial pores between particles. The thermal resistance between nanoparticles is shown to decrease rapidly when water vapor is introduced into the pores between particles. The largest decrease in interparticle resistance occurs as a result of the silanization of the silica particle surfaces. A secondary decrease is attributable to the liquid bridge that forms as water molecules condense around the contact point between nanoparticles. Most of the decrease in resistance between nanoparticles occurs when water vapor is first introduced at relative humidities (rh) of less than 1%. As the relative humidity increases above 1%, the interparticle thermal resistance decreases more slowly, approaching a constant value near 50% rh. Numerical results are compared to experimental measurements of heat transfer across packed beds of 20nm silica nanoparticles exposed to water vapor. The simulation results are shown to be consistent with the experimental measurements for relative humidities below 15% rh, while underpredicting the experimental measurements above 15% rh. Published by AIP Publishing.
机译:基于纳米颗粒的材料因其独特的热性能而受到关注。它们具有已知的所有固体材料中最低的导热率,因此已被广泛用作绝缘材料。然而,已经显示水蒸气的存在对那些性质具有很大的影响。在这项工作中,我们使用非平衡分子动力学模拟研究了水蒸气对纳米颗粒之间热传递的影响。当允许水分子以蒸气形式扩散到粒子之间的空隙中时,我们计算相邻无定形球形二氧化硅纳米粒子之间的绝对热阻和Kapitza电阻。当将水蒸气引入颗粒之间的孔中时,显示出纳米颗粒之间的热阻迅速降低。颗粒间电阻的最大降低是由于二氧化硅颗粒表面的硅烷化而产生的。次要的减少归因于随着水分子在纳米颗粒之间的接触点附近凝结而形成的液桥。当首先以小于1%的相对湿度(rh)引入水蒸气时,纳米颗粒之间的电阻降低大部分发生。当相对湿度增加到1%以上时,颗粒间的热阻降低得更慢,接近50%rh的恒定值。将数值结果与暴露于水蒸气的20nm二氧化硅纳米颗粒填充床之间的传热实验结果进行了比较。相对于低于15%rh的相对湿度,仿真结果显示与实验测量结果一致,而低于15%rh的实验测量结果却被低估了。由AIP Publishing发布。

著录项

  • 来源
    《Journal of Applied Physics 》 |2018年第5期| 054303.1-054303.12| 共12页
  • 作者单位

    Washington State Univ, Sch Mech & Mat Engn, Pullman, WA 99164 USA;

    Washington State Univ, Sch Mech & Mat Engn, Pullman, WA 99164 USA;

    Washington State Univ, Sch Mech & Mat Engn, Pullman, WA 99164 USA;

  • 收录信息 美国《科学引文索引》(SCI);美国《工程索引》(EI);美国《生物学医学文摘》(MEDLINE);
  • 原文格式 PDF
  • 正文语种 eng
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