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Three-Dimensional Printing of Ti_3SiC_2-Based Ceramics

机译:Ti_3SiC_2基陶瓷的三维印刷

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摘要

In the present work, we explored the feasibility of fabricating Ti_3SiC_2-based ceramics by a near-net-shape fabrication process of three-dimensional printing (3D printing) combined with liquid sih'con infiltration (LSI). The porous ceramic preform was fabricated by 3D printing TiC powder with dextrin as a binder. The heat-treated preforms contained bimodal pore structure with interagglomerate pores (d≈23 urn) and intraagglomerate pores (d≈1 μm). Upon infiltration in Ar atmosphere at 1600°-1700 C for 1 h, silicon melt infiltrated the pores and reacted with TiC to yield Ti_3SiC_2, TiSi_2, and SiC. The effects of silicon content and infiltration temperature on the phase composition of the Ti_3SiC_2-based composites were also studied. After LSI at 1700℃ for 1 h, the composites with an initial TiC:Si mole ratio of 3:1.2 attained a bending strength of 293 MPa, a Vickers hardness of 7.2 GPa, and an electrical resistivity of 27.8 μΩ· cm, respectively.
机译:在目前的工作中,我们探讨了通过三维印刷(3D打印)和液体硅渗透(LSI)相结合的近净形制造工艺来制造Ti_3SiC_2基陶瓷的可行性。通过以糊精为粘合剂的3D打印TiC粉体来制造多孔陶瓷预成型坯。经热处理的预成型坯包含双峰孔结构,其中有团聚孔(d≈23um)和团聚孔(d≈1μm)。在1600°-1700 C的Ar气氛中渗透1小时后,硅熔体渗透到孔中并与TiC反应生成Ti_3SiC_2,TiSi_2和SiC。研究了硅含量和浸渗温度对Ti_3SiC_2基复合材料相组成的影响。在1700℃的LSI下放置1 h后,初始TiC:Si摩尔比为3:1.2的复合材料的弯曲强度为293 MPa,维氏硬度为7.2 GPa,电阻率为27.8μΩ·cm。

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    National Key Laboratory of Thermostructure Composite Materials, Northwestern Polytechnical University, Xi'an, Shaanxi 710072, China;

    National Key Laboratory of Thermostructure Composite Materials, Northwestern Polytechnical University, Xi'an, Shaanxi 710072, China;

    National Key Laboratory of Thermostructure Composite Materials, Northwestern Polytechnical University, Xi'an, Shaanxi 710072, China;

    National Key Laboratory of Thermostructure Composite Materials, Northwestern Polytechnical University, Xi'an, Shaanxi 710072, China;

  • 收录信息 美国《科学引文索引》(SCI);美国《工程索引》(EI);美国《生物学医学文摘》(MEDLINE);
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  • 正文语种 eng
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  • 入库时间 2022-08-17 13:39:24

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