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Mechanism of Formation of Amorphous Silica Inclusion in Silicon Deoxidized Copper

机译:硅脱氧铜中非晶硅夹杂物形成的机理

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To investigate the formation mechanism of secondary amorphous silica inclusion in iron and copper, sili-on-deoxidation experiment of copper at 1423 K was performed. In the copper quenched into water after deoxidation, three types of secondary amorphous silica inclusions (pinecone-like inclusion, gourd-shaped inclusion and network-like inclusion) were observed. In the copper cooled ultra-rapidly, fine spherical inclusion and coral-like inclusion, which were secondary and amorphous, were observed. The experimental temperature of 1423 K is not only 573 K lower than the melting point of silica but also 20 K lower than the glass transition temperature of silica (1443 K). Therefore, the presence of secondary amorphous silica inclusion should be strong evidence of the formation of liquid silica during cooling of the copper without temperature rise. It would also support the formation of secondary liquid silica inclusion in the iron alloy. Consideration based on Ostwald's Step Rule indicated that liquid silica inclusion could be formed from the supersaturated state of copper.
机译:为研究铁和铜中次生非晶态二氧化硅夹杂物的形成机理,在1423 K下进行了铜的硅脱氧化实验。在脱氧后淬火成水的铜中,观察到三种类型的次级无定形二氧化硅夹杂物(松果状夹杂物,葫芦状夹杂物和网状状夹杂物)。在快速冷却的铜中,观察到细小的球形夹杂物和珊瑚状夹杂物,它们是次生的和无定形的。 1423 K的实验温度不仅比二氧化硅的熔点低573 K,而且比二氧化硅的玻璃化转变温度(1443 K)低20K。因此,次要无定形二氧化硅夹杂物的存在应有力地证明在冷却铜的过程中会形成液态二氧化硅而不会引起温度升高。它还将支持在铁合金中形成二次液态二氧化硅夹杂物。基于奥斯特瓦尔德步骤规则的考虑表明,液态二氧化硅夹杂物可以由铜的过饱和状态形成。

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