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Investigation of Thermal Expansion of a Glass–Ceramic Material with an Extra-Low Thermal Linear Expansion Coefficient

机译:具有超低热线性膨胀系数的玻璃陶瓷材料的热膨胀研究

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摘要

The artificial material sitall CO-115M was developed purposely as a material with an extra-low thermal expansion. The controlled crystallization of an aluminosilicate glass melt leads to the formation of a mixture of β-spodumen, β-eucryptite, and β-silica anisotropic microcrystals in a matrix of residual glass. Due to the small size of the microcrystals, the material is homogeneous and transparent. Specific lattice anharmonism of these microcrystal materials results in close to zero average thermal linear expansion coefficient (TLEC) of the sitall material. The thermal expansion coefficient of this material was measured using an interferometric method in line with the classical approach of Fizeau. To obtain the highest accuracy, the registration of light intensity of the total interference field was used. Then, the parameters of the interference pattern were calculated. Due to the large amount of information in the interference pattern, the error of the calculated fringe position was less than the size of a pixel of the optical registration system. The thermal expansion coefficient of the sitall CO-115M and its temperature dependence were measured. The TLEC value of about 3 × 10−8 K−1 to 5 × 10−8 K−1 in the temperature interval from −20 °C to +60 °C was obtained. A special investigation was carried out to show the homogeneity of the material.
机译:人造材料通体套装CO-115M是专门为具有极低热膨胀率的材料而开发的。铝硅酸盐玻璃熔体的受控结晶会导致在残留玻璃的基质中形成β-球蛋白,β-锂霞石和β-二氧化硅各向异性微晶的混合物。由于微晶的尺寸小,因此该材料是均匀且透明的。这些微晶材料的特定晶格非谐性导致通体材料的平均平均热线性膨胀系数(TLEC)接近于零。该材料的热膨胀系数是采用干涉法根据Fizeau的经典方法进行测量的。为了获得最高的精度,使用了总干扰场的光强度配准。然后,计算干涉图案的参数。由于干涉图案中的大量信息,计算出的条纹位置的误差小于光学配准系统的像素的尺寸。测量了座舱CO-115M的热膨胀系数及其温度依赖性。 TLEC值约为3×10 -8 K -1 到5×10 -8 K -1 获得了-20°C至+60°C的温度区间。进行了专门的研究,以显示材料的均质性。

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