Guest editorial for the special issue on 'computational multiphysics methods for integrated circuits and packaging'

摘要

It is well-known that both the reliability and performance of present-day integrated circuits and their packages cannot be completely understood or accurately predicted from electromagnetic considerations alone. For example, the physical characteristics of high-density interconnects and micro/ nanoelectronic passive and active devices are often affected by heat conduction and mechanical stresses/deformations, in extreme cases leading to electro-thermo-mechanical breakdown. Under such circumstances, predictive simulations must rely on multiphysics computational approaches as opposed to electromagnetics-only methods.